Home > Rogers PCB Board >

15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

Product Categories

RF PCB Board [303]
Rogers PCB Board [170]
PTFE PCB Board [15]
High TG PCB [12]
Multi Layer PCB [50]
Taconic PCB [20]
HDI PCB Board [14]
High Speed PCB [33]
Impedance Controlled PCB [13]
Flexible PCB Board [102]
FR4 PCB Board [32]
PCB Stencil [13]
Metal Core PCB [26]

Bicheng Electronics Technology Co., Ltd

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

Name: 15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers
Brand: Bicheng
Price: 9.99 USD

China 15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers wholesale

Brand Name : Bicheng

Model Number : BIC-148.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : Ceramic, Hydrocarbon, Thermoset Polymer Composites

Layer count : Double Layer, Multilayer, Hybrid PCB

PCB size : ≤400mm X 500mm

PCB thickness : 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500m

Solder mask : Green, Black, Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Surface finish : Bare copper, HASL, ENIG, OSP etc..

Contact Now

Rogers 15mil TMM10 High Frequency PCB With Immersion Gold and Green Solder Mask for Chip Testers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.

TMM10 laminates' electrical and mechanical characteristics combine many of the advantages of ceramic and conventional PTFE microwave circuit laminates without the need for the specific manufacturing processes typical of these materials.

The thermal coefficient of dielectric constant of TMM10 laminates is typically less than 30 ppm/°C, which is extremely low. The material can produce high reliability plated through holes with minimal etch shrinkage values thanks to its isotropic coefficients of thermal expansion, which are extremely closely matched to those of copper. Additionally, TMM10 laminates' thermal conductivity is about twice as high as that of conventional PTFE/ceramic laminates, making it easier to remove heat from the system.

The thermoset resins used in TMM10 laminates prevent them from softening when heated. As a result, there is no need to worry about pad lifting or other issues while wire bonding component leads to circuit traces.

Some Typical Applications:

1. Filters and coupler

2. Power amplifiers and combiners

3. RF and microwave circuitry

Our Capabilities (TMM10)

PCB Material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM10
Dielectric constant:	9.20 ±0.23
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB thickness:
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of TMM10

TMM10 Typical Value
Property		TMM10	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.20±0.23	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.8	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.0022	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-38	-	ppm/°K	-55℃-125℃	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 10⁸	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 10⁷	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		285	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		21	X	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		21	Y	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ℃	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		13.62	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.79	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.09	-	%	D/24/23	ASTM D570
Moisture Absorption (2X2)	3.18mm (0.125")	0.2	-	%	D/24/23	ASTM D570
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.74	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

Product Tags:

15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Bicheng Electronics Technology Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

TMM10 Rogers PCB Board

15mil Rogers PCB Board

TMM10 Rogers Printed Circuit Board

15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers Images